SML02G
特点
● 高Tg >170℃ (DSC)，无卤材料
●较低 X/Y轴 CTE (＜13ppm)，可提供优异的通孔性能
● 较低的插损表现，Dk/Df@10GHz:4.24/0.069
● 极好的耐离子迁移能力
应用领域
服务器，交换机，基站
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- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | |
|
|
|
DSC |
℃ |
175 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 420 | |
| CTE (X/Y-axis) | IPC-TM-650 2.4.24.5 | 50-125℃ | ppm/℃ | 11-13 | |
|
CTE (Z-axis) |
IPC-TM-650 2.4.24 |
Before Tg |
ppm/℃ |
25 | |
| After Tg | ppm/℃ | 125 | |||
|
50 |
% | 1.2 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | min | PASS | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 3.76 x 107 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.16 x 107 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 180 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
|
Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.15 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 4.24 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0053 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- |
0.0069 |
||
| Peel Strength (1Oz) | IPC-TM-650 2.4.8 | After thermal Stress 288℃,10s | N/mm | 1.00 | |
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.
2. The typical CTE value is based on specimen with 2116, whilethe Tg is for specimen≥0.50mm.
3. All the typical values listed aboveare for your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.